JPH033372B2 - - Google Patents

Info

Publication number
JPH033372B2
JPH033372B2 JP61131366A JP13136686A JPH033372B2 JP H033372 B2 JPH033372 B2 JP H033372B2 JP 61131366 A JP61131366 A JP 61131366A JP 13136686 A JP13136686 A JP 13136686A JP H033372 B2 JPH033372 B2 JP H033372B2
Authority
JP
Japan
Prior art keywords
lead wire
slit
lead
electronic component
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61131366A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61287118A (ja
Inventor
Masahiro Imanishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61131366A priority Critical patent/JPS61287118A/ja
Publication of JPS61287118A publication Critical patent/JPS61287118A/ja
Publication of JPH033372B2 publication Critical patent/JPH033372B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP61131366A 1986-06-06 1986-06-06 電子部品の製造方法 Granted JPS61287118A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61131366A JPS61287118A (ja) 1986-06-06 1986-06-06 電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61131366A JPS61287118A (ja) 1986-06-06 1986-06-06 電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS61287118A JPS61287118A (ja) 1986-12-17
JPH033372B2 true JPH033372B2 (en]) 1991-01-18

Family

ID=15056246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61131366A Granted JPS61287118A (ja) 1986-06-06 1986-06-06 電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS61287118A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0293822U (en]) * 1989-01-13 1990-07-25

Also Published As

Publication number Publication date
JPS61287118A (ja) 1986-12-17

Similar Documents

Publication Publication Date Title
US5334059A (en) Solder-bearing lead
US4780098A (en) Conductive lead arrangement
US5441430A (en) Electrical lead for surface mounting of substrates
JPH08139257A (ja) 面実装型半導体装置
JPH033372B2 (en])
US5107324A (en) Two-terminal semiconductor device of surface installation type
JPS62566B2 (en])
JPS62118555A (ja) 集積回路パツケ−ジ
JPS637029B2 (en])
JPH0227522Y2 (en])
JPS5843235Y2 (ja) Dhd形ダイオ−ド
JP3052485B2 (ja) 電子部品の製造方法
JPS6221008Y2 (en])
JPH0356032Y2 (en])
JPS62282456A (ja) ハイブリッドicの製造方法
JPH05275216A (ja) Sip形面実装ネットワーク抵抗器の製造方法
EP0112899B1 (en) Solder bearing terminal pin
JPH083018Y2 (ja) 半導体パッケージ用連結型リードフレーム
JPH05291739A (ja) 接続用端子及びこれを用いた装置の接続方法
JP2958597B2 (ja) Icパッケージの製造方法とメッキ用フレーム
JP2902543B2 (ja) 鍍金用治具
JP2522657B2 (ja) リ−ドフレ−ムの製造方法
JPS5852343B2 (ja) ハンドウタイソウチノ セイゾウホウホウ
WO1996036090A1 (en) Method and apparatus for surface-mounting multi-legged components
JPS61216349A (ja) ガラス端子のメツキ方法